KUAS Engineering Master’s Student Receives the JSME 2022 Young Fellow Award
News Engineering 2023.02.07
Mr. Yasugi and his colleagues at the Nanomechatronics Laboratory are developing new technology for joining two wafers in less than 0.1 seconds using an aluminum-nickel (Al/Ni) multilayer film that instantaneously self-propagates and generates heat when a minute external stimulus is applied. This is an energy-saving and eco-friendly technology that is expected to significantly reduce the time and cost associated with power semiconductor device manufacturing and packaging. While developing this technology, Mr. Yasugi and his colleagues faced problems in which minute defects, such as voids and microcracks, remained in the joined section, causing the strength and thermal resistance of the joint to deteriorate. Through their research, they succeeded in significantly reducing those defects by introducing boron to the Al/Ni multilayers, which improved their fracture toughness. This results in increased bonding strength and reduced thermal resistance. With that, new technology that is expected to impact next-generation power semiconductor device manufacturing processes while positively contributing to the environment.
Mr. Yasugi commented, “It is a great honor for my research results to be recognized twice in this academic year. I struggled to pursue experiments technically, but now I feel proud to have worked so hard.” Professor Namazu added, “This award is solely the result of his continuous great efforts. Daisuke has contributed to show KUAS’s strong research activity to the world."
(Tadayuki Imai, Faculty of Engineering)(Tadayuki Imai, Faculty of Engineering)