Kana Maekawa, Kenta Kodama, and Dr. Namazu received the JSME Best Presentation Paper Award
News Engineering 2021.03.08
At the Nanomechatronics Laboratory, these researchers are developing a unique technology for joining two wafers in less than 0.1 seconds using an aluminium-nickel (Al/Ni) multilayer film that instantaneously self-propagates and generates heat when a minute external stimulus is applied. This is an energy-saving and eco-friendly technology that is expected to significantly reduce the time and cost associated with semiconductor device manufacturing and packaging. While developing this technology the researchers faced the problem that minute defects remained in the jointed section, and the strength and thermal resistance of the joint deteriorated. In their research they succeeded in optimising the composition of bonding materials, such as the Al/Ni multilayer film, and in significantly reducing defects such as voids at the Ni/Al-solder interface and microcracks within the Ni/Al film. The result is increased bonding strength and reduced thermal resistance, and a new technology that is expected to impact next-generation semiconductor device manufacturing processes while contributing positively to the environment.
Visiting researcher Maekawa and master’s student Kodama said, “It is a great honour for our research results to be recognised by the Japan Society of Mechanical Engineers. It was difficult for us to pursue new research, but now we feel proud to have worked so hard. We hope that our research results will improve the lives of everyone in the future.” Professor Namazu added, “This award is solely the result of the great efforts of our laboratory students. We will continue to work together with the students to pursue our challenging research.”
(Tadayuki Imai, Faculty of Engineering)