KUAS-E's Maekawa received the 15th Wakashachi Excellence Award
News Engineering 2021.02.16
Ms. Maekawa is creating a unique technology that joins two wafers in less than 0.1 seconds using a self-propagating exothermic reaction in Al/Ni multilayer films by applying a minute external stimulus. This technology is expected to significantly reduce the process time and cost in semiconductor packaging, and to be an energy-saving and eco-friendly technology. Unfortunately a big problem with this technique is that cracks are introduced in the joint section. Ms. Maekawa discovered the possibility of artificially controlling the position and propagation direction of cracks by constructing a new, multipoint, simultaneous laser reaction induction system. Using this technology, if cracks are formed at desired positions where bonded wafers are to be cut then no cracks will remain inside the final device chips. Crack-free bonding can be achieved. Ms. Maekawa’s technique is expected to become a promising new technology in the semiconductor device industry that can also benefit the environment.
Ms. Maekawa said, “I am honoured to receive the Wakashachi Excellence Award. It was very difficult to design and develop a new device to prove my idea and perform an experiment that no one had done before, and I am very happy that the efforts and research results so far have been evaluated. I will continue to strive for better results.”
(Tadayuki Imai, Faculty of Engineering)