【工学部ニュース】前川夏菜客員研究員，児玉健太君，生津資大教授（工学部ナノメカトロニクス研究室）が日本機械学会マイクロ・ナノ工学部門優秀講演論文表彰を受賞

本学教員の生津資大教授（工学部／専門分野：ナノメカニクス、ナノテクノロジー、機能性材料）が率いるナノメカトロニクス研究室所属の前川夏菜客員研究員、大学院修士1年生児玉健太君、生津資大教授の三名が、「Al/Ni発熱多層膜とはんだ膜の自立化が瞬間接合体の熱・機械信頼性に及ぼす影響」の研究発表で日本機械学会マイクロ・ナノ工学部門優秀講演論文表彰を受賞しました。この賞は、マイクロ・ナノ工学部門主催の講演会および年次大会での発表から研究内容が特に優れている論文の著者全員を表彰するものであり、2020年9月にオンライン開催された同学会年次大会での発表内容が評価され、受賞に至りました。

生津研究室では、微小外部刺激の付与で瞬間的に自己伝播発熱するAl/Ni多層膜を用い、0.1秒未満で2枚のウェハを接合する独自技術を開発しています。この技術は半導体部品の製造にかかる時間とコストの大幅削減が見込める省エネかつエコな技術です。しかし、接合部には細かな欠陥が残り、接合部の強度と熱抵抗が悪化する課題があります。この研究では、Al/Ni多層膜をはじめとする接合材料の構成を最適化し、NiAl-はんだ界面のボイドとNiAl内部のマイクロクラックといった欠陥を大幅に減少させることに成功しました。この成果は接合強度の向上と熱抵抗の低下をもたらし、近い将来、環境問題に配慮しつつ、次世代の半導体部品製造工程に一石を投じる新技術になるものと期待できます。

前川客員研究員ならびに児玉君は、「私たちの研究成果が日本機械学会に認められてとても光栄です。新しい研究への挑戦は困難の連続でしたが、頑張ってきて良かったです。私たちの技術で皆さんの生活が少しでも豊かになれば嬉しいです」と喜びを語っていました。生津教授は「今回の受賞はひとえに学生達の努力の賜物です。これからも学生達と一丸になって挑戦的研究を進めていきます」と意気込みを述べていました。

（工学部　今井　欽之）

関連リンク

生津 資大教授の教員紹介はこちら

生津 資大教授の先生に聞いてみたはこちら

Kana Maekawa, Kenta Kodama, and Takahiro Namazu received the JSME Best Presentation Paper Award

KUAS Faculty of Engineering visiting researcher Kana Maekawa, first-year master’s course student Kenta Kodama, and Professor Takahiro Namazu, all members of the Nanomechatronics Laboratory (specialising in nanomechanics, nanotechnology, and functional materials), have received the Best Presentation Paper Award from the Micro-Nano Science & Engineering Division of the Japan Society of Mechanical Engineers (JSME) for their presentation entitled “Influence of free-standing solder film and Al/Ni exothermic multilayer film on the thermal and mechanical reliability of reactively-soldered Si mechanical joints.” This award recognises all co-authors listed on papers with outstanding research topics and achievements among those presented at conferences and symposia organised by the JSME Micro-Nano Science & Engineering Division. Following a presentation at the 2020 JSME Annual Meeting their research achievements were very positively evaluated which culminated in their award.

At the Nanomechatronics Laboratory, these researchers are developing a unique technology for joining two wafers in less than 0.1 seconds using an aluminium-nickel (Al/Ni) multilayer film that instantaneously self-propagates and generates heat when a minute external stimulus is applied. This is an energy-saving and eco-friendly technology that is expected to significantly reduce the time and cost associated with semiconductor device manufacturing and packaging. While developing this technology the researchers faced the problem that minute defects remained in the jointed section, and the strength and thermal resistance of the joint deteriorated. In their research they succeeded in optimising the composition of bonding materials, such as the Al/Ni multilayer film, and in significantly reducing defects such as voids at the Ni/Al-solder interface and microcracks within the Ni/Al film. The result is increased bonding strength and reduced thermal resistance, and a new technology that is expected to impact next-generation semiconductor device manufacturing processes while contributing positively to the environment.

Visiting researcher Maekawa and master’s student Kodama said, “It is a great honour for our research results to be recognised by the Japan Society of Mechanical Engineers. It was difficult for us to pursue new research, but now we feel proud to have worked so hard. We hope that our research results will improve the lives of everyone in the future.” Professor Namazu added, “This award is solely the result of the great efforts of our laboratory students. We will continue to work together with the students to pursue our challenging research.”

(Tadayuki Imai, Faculty of Engineering)