大学院工学研究科修士2年生の安木大恭君（工学部ナノメカトロニクス研究室）が国際会議ICPE2022でYoung Researcher Awardを受賞／Daisuke Yasugi, KUASE 2nd year master’s student, received the ICPE 2022 Young Researcher Award

本学工学部教員の生津資大教授（工学部／専門分野：ナノメカニクス、ナノテクノロジ、機能性材料）の率いるナノメカトロニクス研究室所属の安木大恭さん（大学院修士2年生）がThe 19^th International Conference on Precision Engineering（ICPE2022 in Nara）にて「Mechanical Reliability of Reactively Alloyed B-NiAl Film for Crack-less Instantaneous Bonding」の研究発表を行い、Young Researcher Awardを受賞しました。この賞は、国際会議ICPEが精密工学に関する研究を精力的に行っている若手研究者を表彰するもので、2022年12月に奈良県コンベンションセンターで開催されたICPE2022 in Naraの会期中に授賞式が行われました。

生津研究室では、微小外部刺激の付与で瞬間的に自己伝播発熱するAl/Ni多層膜を用い、0.1秒未満で2枚のウェハを接合する独自技術を開発しています。この技術は半導体部品の製造にかかる時間とコストの大幅削減が見込める省エネかつエコな技術です。しかし、接合部にはボイドやクラック等の細かな欠陥が残り、強度と熱抵抗が低下する課題があります。この研究では、Al/Ni発熱多層膜にボロンB添加物を一定量加えて反応後のB-NiAlを高靭化し、接合体内部に形成されるクラックを大幅に低減させることに成功しました。この成果は接合強度の向上と熱抵抗の低下をもたらし、近い将来、環境問題に配慮しつつ、次世代のパワー半導体実装工程に一石を投じる新技術になるものと期待できます。

安木さんは、「私の研究成果が国際的に認められてとても光栄です。新しい研究への挑戦は困難の連続でしたが、頑張ってきて良かったです」と喜びを語っていました。生津教授は「安木君の日々の努力が認められて良かったです。これからも学生達とともに挑戦的研究を進めていきます」と意気込みを述べていました。

（工学部教授　今井欽之）

Daisuke Yasugi, KUAS Engineering 2nd year master’s student, received the ICPE 2022 Young Researcher Award

Daisuke Yasugi, a second-year master’s student at the KUAS Graduate School of Engineering and a member of the Nanomechatronics Laboratory (specializing in nanomechanics, nanotechnology, and functional materials, directed by Professor Takahiro Namazu), has received the Young Researcher Award from the 19^th International Conference on Precision Engineering (ICPE 2022) held in Nara Prefecture Convention Center for his presentation entitled “Mechanical Reliability of Reactively Alloyed B-NiAl Film for Crack-less Instantaneous Bonding”. This award recognizes outstanding research work performed by young researchers among the presenters at the conference. Mr. Yasugi’s research and presentation were very positively evaluated, leading to this award.

At the Nanomechatronics Laboratory, Mr. Yasugi and his colleagues are developing a unique technology for joining two wafers in less than 0.1 seconds using an aluminum-nickel (Al/Ni) multilayer film that instantaneously self-propagates and generates heat when a minute external stimulus is applied. This is an energy-saving and eco-friendly technology that is expected to significantly reduce the time and cost associated with power semiconductor device manufacturing and packaging. While developing this technology they faced the problem that minute defects, such as voids and microcracks, remained in the jointed section causing the strength and thermal resistance of the joint to deteriorate. In their research they succeeded in significantly reducing those defects within the Ni/Al film after the reaction by adding B to the Al/Ni multilayers and thereby improving its fracture toughness. The result is increased bonding strength and reduced thermal resistance, and a new technology that is expected to impact next-generation power semiconductor device manufacturing processes while contributing positively to the environment.

Mr. Yasugi said, “It is a great honor for my research results to be recognized by ICPE 2022. It was difficult for me to pursue new research, but now I feel proud to have worked so hard.” Professor Namazu added, “This award is solely the result of his continuous great efforts. We will continue to work together with the students to pursue our challenging research.”

(Tadayuki Imai, Faculty of Engineering)